Output details
13 - Electrical and Electronic Engineering, Metallurgy and Materials
Loughborough University
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Article title
Analysis of critical-length data from Electromigration failure studies
Type
D - Journal article
Title of journal
Microelectronics Reliability
Article number
-
Volume number
51
Issue number
9-11
First page of article
1568
ISSN of journal
0026-2714
Year of publication
2011
URL
-
Number of additional authors
0
Additional information
International recognition from a group working jointly between Bordeaux IMS and Hannover led by Dr Kirsten Weige-Zaage (University of Hannover, Germany (weide-zaage@lfi.uni-hannover.de) has led to collaboration with that group. Subsequent work seeks to explain the experimental results on migration of intermetallics in solder ball grid array microbumps, obtained at the IMS Laboratory in the University of Bordeaux (France), through detailed simulation of the processes involved.
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-