Output details
12 - Aeronautical, Mechanical, Chemical and Manufacturing Engineering
Loughborough University
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Article title
A micromechanism study of thermosonic gold wire bonding on aluminum pad
Type
D - Journal article
Title of journal
Journal of Applied Physics
Article number
113517
Volume number
108
Issue number
11
First page of article
1
ISSN of journal
0021-8979
Year of publication
2010
URL
-
Number of additional authors
7
Additional information
This paper was the research outcome of a collaboration with Nanyang Technological University Singapore, for the first time elaborating the fundamentals of the bonding mechanism of Au/Al bonds produced by the wire bonding process at micro- and nano-scale using XTEM analysis. This led to optimum manufacturing of such bonds to enable more reliable ultrafine pitch interconnects. ASM Ltd at Singapore (Siva@asmpt.com) participated and supported the research and can verify the significance and quality of this research to industry.
Interdisciplinary
-
Cross-referral requested
-
Research group
None
Proposed double-weighted
No
Double-weighted statement
-
Reserve for a double-weighted output
No
Non-English
No
English abstract
-
