You are in : Home » Results & submissions » Select UOA » 13 - Electrical and Electronic Engineering, Metallurgy and Materials » View submission: University of Greenwich » Outputs » Detail

Output details

13 - Electrical and Electronic Engineering, Metallurgy and Materials

University of Greenwich

Return to search Previous output Next output

Output 10 of 31 in the submission

Article title

Design for reliability of power electronics modules

Type

D - Journal article

DOI

10.1016/j.microrel.2009.07.055

Title of journal

Microelectronics Reliability

Article number

Volume number

Issue number

9-Nov

First page of article

1250

ISSN of journal

0026-2714

Year of publication

2009

URL

http://gala.gre.ac.uk/4470/

Number of additional authors

Additional information

A first in presenting a physics-of-failure approach to predicting lifetime/reliability of wirebonds, solder joints and bussbars for power electronics modules. Output contributed to award of two new grants - Robustness design & health management in power electronics using damage mechanics based models (RODENT, Funded by EPSRC/IeMRC , SP/03/02/11), and the FP7 Clean Skies project PEMREL (Grant No. 271788). The output is significant as the developed models are providing our industrial partners with design rules and reliability predictions for new power electronics module designs (Liam Mills, R&D Manager, Liam.Mills@semelab-tt.com), (Steve Jones, R&D Manager, Steve_Jones@dynexsemi.com).

Interdisciplinary

Cross-referral requested

Research group

1 - Centre for Numerical Modelling and Process Analysis (CNMPA)

Proposed double-weighted

Double-weighted statement

Reserve for a double-weighted output

Non-English

English abstract